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(R)
TN12, TS12 and TYNx12 Series
12A SCRS
A
SENSITIVE & STANDARD
Table 1: Main Features Symbol IT(RMS) VDRM/VRRM IGT Value 12 600 to 1000 0.2 to 15 Unit A V mA
A
G
K
A
DESCRIPTION Available either in sensitive (TS12) or standard (TN12 / TYN) gate triggering levels, the 12A SCR series is suitable to fit all modes of control, found in applications such as overvoltage crowbar protection, motor control circuits in power tools and kitchen aids, inrush current limiting circuits, capacitive discharge ignition and voltage regulation circuits... Available in through-hole or surface-mount packages, they provide an optimized performance in a limited space area.
KA G
KA G
DPAK (TN12-B / TS12-B)
A
D2PAK (TN12-G)
A
K
A
K G
A G
IPAK (TN12-H / TS12-H)
TO-220AB (TYNx12RG)
Table 2: Order Codes Part Numbers TN1215-x00B TN1215-x00B-TR TN1215-x00G TN1215-x00G-TR TN1215-x00H TS1220-x00B TS1220-x00B-TR TS1220-x00H TYNx12RG TYNx12TRG Marking TN1215x00 TN1215x00 TN1215x00G TN1215x00G TN1215x00 TS1220x00 TS1220x00 TS1220x00 TYNx12 TYNx12T
October 2005
REV. 5
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TN12, TS12 and TYNx12 Series
Table 3: Absolute Ratings (limiting values) Value Symbol Parameter TN12-G TYN12 Tc = 105C Tc = 105C Tj = 25C Tj = 25C Tj = 125C Tj = 125C Tj = 125C 145 140 98 50 4 1 - 40 to + 150 - 40 to + 125 5 TN12-B/H TS12-B/H 12 8 115 110 60 A A2S A/s A W C V Unit
IT(RMS) IT(AV) ITSM I t dI/dt IGM PG(AV) Tstg Tj VRGM
RMS on-state current (180 conduction angle) Average on-state current (180 conduction angle) Non repetitive surge peak onstate current It Value for fusing tp = 8.3 ms tp = 10 ms tp = 10 ms
A A
Critical rate of rise of on-state current IG = 2 x IGT , tr 100 ns F = 60 Hz Peak gate current Average gate power dissipation Storage junction temperature range Operating junction temperature range tp = 20 s
Maximum peak reverse gate voltage (for TN12 & TYN12 only)
Tables 4: Electrical Characteristics (Tj = 25C, unless otherwise specified)
SENSITIVE Test Conditions VD = 12 V VD = VDRM IRG = 10 A IT = 50 mA IG = 1 mA RGK = 1 k RGK = 1 k RGK = 220 Tj = 125C Tj = 25C Tj = 125C Tj = 125C Tj = 25C Tj = 125C RL = 140 RL = 3.3 k RGK = 1 k Tj = 125C MAX. MAX. MIN. MIN. MAX. MAX. MIN. MAX. MAX. MAX. MAX. 2 mA TS1220 200 0.8 0.1 8 5 6 5 1.6 0.85 30 5 Unit A V V V mA mA V/s V V m A
Symbol IGT VGT VGD VRG IH IL dV/dt VTM Vt0 Rd IDRM IRRM
VD = 65 % VDRM ITM = 24 A
tp = 380 s
Threshold voltage Dynamic resistance VDRM = VRRM RGK = 220
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TN12, TS12 and TYNx12 Series
STANDARD Test Conditions MIN. VD = 12 V VD = VDRM IT = 500 mA IG = 1.2 IGT VD = 67 % VDRM ITM = 24 A Threshold voltage Dynamic resistance VDRM = VRRM Gate open Tj =125C Tj = 25C Tj = 125C Tj = 125C Tj = 25C Tj = 125C tp = 380 s RL = 33 RL = 3.3 k Gate open Tj = 125C MAX. MAX. MIN. MAX. MAX. MIN. MAX. MAX. MAX. MAX. 40 80 200 1.6 0.85 30 5 2 30 60 TN1215 B/H 2 15 1.3 0.2 15 30 40 30 60 200 G 0.5 5 TYN x12T x12 2 15 Unit mA V V mA mA V/s V V m A mA
Symbol IGT VGT VGD IH IL dV/dt VTM Vt0 Rd IDRM IRRM
Table 6: Thermal resistance Symbol Rth(j-c) Junction to case (DC) S = 0.5 cm Rth(j-a) Junction to ambient (DC) S = 1 cm DPAK D2PAK IPAK TO-220AB
S = Copper surface under tab.
Parameter
Value 1.3 70 45 100 60
Unit C/W
C/W
Figure 1: Maximum average power dissipation versus average on-state current
P(W)
12 11 10 9 8 7 6 5 4 3 2 1 0 0 1 2 3 4 5 6 7
360
= 180
Figure 2: Average and D.C. on-state current versus case temperature
IT(AV)(A)
14
D.C.
12 10
= 180
8 6 4 2
IT(AV)(A)
8 9
Tcase(C)
0 0 25 50 75 100 125
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TN12, TS12 and TYNx12 Series
Figure 3: Average and D.C. on-state current versus ambient temperature (device mounted on FR4 with recommended pad layout) (DPAK)
IT(AV)(A)
3.0 2.5
D.C.
Figure 4: Relative variation of thermal impedance junction to case versus pulse duration
K=[Zth(j-c)/Rth(j-c)]
1.0
2.0 1.5
= 180
D2PAK
0.5
1.0 0.5
DPAK
0.2
Tamb(C)
0.0 0 25 50 75 100 125
tp(s)
0.1 1E-3 1E-2 1E-1 1E+0
Figure 5: Relative variation of thermal impedance junction to ambient versus pulse duration (recommended pad layout, FR4 PC board for DPAK)
K=[Zth(j-a)/Rth(j-a)]
1.00
Figure 6: Relative variation of gate trigger current and holding current versus junction temperature for TS8 series
IGT,IH,IL[Tj] / IGT,IH,IL[Tj=25C]
2.0 1.8 1.6
DPAK IGT
1.4
D2PAK
1.2
TO-220AB / IPAK
0.10
1.0 0.8 0.6 0.4
IH & IL RGK = 1k
tp(s)
0.01 1E-2 1E-1 1E+0 1E+1 1E+2 5E+2
0.2 0.0 -40 -20 0 20
Tj(C)
40 60 80 100 120 140
Figure 7: Relative variation of gate trigger current and holding current versus junction temperature for TN8 & TYN08 series
IGT,IH,IL[Tj] / IGT,IH,IL[Tj=25C]
2.4 2.2 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 -40 -20 0 20 40 60 80 100 120 140
IH & IL IGT
Figure 8: Relative variation of holding current versus gate-cathode resistance (typical values) for TS8 series
IH[RGK] / IH[RGK=1k]
5.0
Tj = 25C
4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0
Tj(C)
0.5 0.0 1E-2 1E-1
RGK(k)
1E+0 1E+1
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TN12, TS12 and TYNx12 Series
Figure 9: Relative variation of dV/dt immunity versus gate-cathode resistance (typical values) for TS8 series
dV/dt[RGK] / dV/dt[RGK=220]
10.0
Tj = 125C VD = 0.67 x VDRM
Figure 10: Relative variation of dV/dt immunity versus gate-cathode capacitance (typical values) for TS8 series
dV/dt[CGK] / dV/dt[RGK=220]
4.0 3.5 3.0 2.5
VD = 0.67 x VDRM Tj = 125C RGK = 220
1.0
2.0 1.5 1.0
RGK(k)
0.1 0 200 400 600 800 1000 1200
0.5 0.0 0 25 50
CGK(nF)
75 100 125 150
Figure 11: Surge peak on-state current versus number of cycles
Figure 12: Non-repetitive surge peak on-state current for a sinusoidal pulse with width tp < 10 ms, and corresponding values of It
ITSM(A), I2t (A2s)
2000
Tj initial = 25C
ITSM(A)
150 140 130 120 110 100 90 80 70 60 50 40 30 20 10 0 1
1000
TN12 / TYN12 Non repetitive Tj initial=25C TS12 tp=10ms One cycle
ITSM
TN12 / TYN12 TS12
dI/dt limitation
100
I2t
TN12 / TYN12
TS12 Repetitive TC=105C
Number of cycles
10
tp(ms)
0.01 0.10 1.00 10.00
10
100
1000
Figure 13: On-state characteristics (maximum values)
Figure 14: Thermal resistance junction to ambient versus copper surface under tab (epoxy printed circuit board FR4, copper thickness: 35m) (DPAK and D2PAK)
Rth(j-a)(C/W)
100
ITM(A)
200 100
Tj max.: Vt0=0.85V Rd=30m
80
60
Tj=max DPAK
10
Tj=25C
40
D2PAK
20
VTM(V)
1 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
0 0 2 4 6 8
S(cm)
10 12 14 16 18 20
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TN12, TS12 and TYNx12 Series
Figure 15: Ordering Information Scheme (TN8 series)
TN 12 15 - 600 B (-TR)
Standard SCR series Current 12 = 12A Sensitivity 15 = 15mA Voltage 600 = 600V 800 = 800V 1000 = 1000V Package B = DPAK G = D2PAK H = IPAK Packing mode Blanck = Tube -TR = Tape & Reel (DPAK and D2PAK)
Figure 16: Ordering Information Scheme (TS8 series)
TS 12 20 - 600 B (-TR)
Sensitive SCR series Current 12 = 12A Sensitivity 20 = 200A Voltage 600 = 600V 700 = 700V Package B = DPAK H = IPAK Packing mode Blanck = Tube -TR = Tape & Reel
Figure 17: Ordering Information Scheme (TYN08 series)
TYN
Standard SCR series Voltage 6 = 600V 8 = 800V 10 = 100V Current 12 = 12A Sensitivity Blanck = 30mA T = 15mA Packing mode RG = Tube
6
12
T
RG
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TN12, TS12 and TYNx12 Series
Table 7: Product Selector Part Numbers TN1215-xxxB TN1215-xxxG TN1215-xxxH TS1220-xxxB TS1220-xxxH TYNx12 TYNx12T Voltage (xxx) 600 V X X X X X X X X X X X X X 700 V 800 V X X X X 1000 V Sensitivity 15 mA 15 mA 15 mA 0.2 mA 0.2 mA 15 mA 5 mA Package DPAK D2PAK IPAK DPAK IPAK TO-220AB TO-220AB
Figure 18: DPAK Package Mechanical Data REF.
E B2 C2 L2 A
D H L4 B G A1 C R R
A2 0.60 MIN.
V2
A A1 A2 B B2 C C2 D E G H L2 L4 V2
DIMENSIONS Millimeters Inches Min. Max Min. Max. 2.20 2.40 0.086 0.094 0.90 1.10 0.035 0.043 0.03 0.23 0.001 0.009 0.64 0.90 0.025 0.035 5.20 5.40 0.204 0.212 0.45 0.60 0.017 0.023 0.48 0.60 0.018 0.023 6.00 6.20 0.236 0.244 6.40 6.60 0.251 0.259 4.40 4.60 0.173 0.181 9.35 10.10 0.368 0.397 0.80 typ. 0.031 typ. 0.60 1.00 0.023 0.039 0 8 0 8
Figure 19: DPAK Foot Print Dimensions (in millimeters)
6.7
3
3
1.6
2.3 6.7 2.3
1.6
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TN12, TS12 and TYNx12 Series
Figure 20: D2PAK Package Mechanical Data DIMENSIONS REF. Millimeters Inches Min. Typ. Max. Min. Typ. A 4.30 4.60 0.169 A1 2.49 2.69 0.098 A2 0.03 0.23 0.001 B 0.70 0.93 0.027 B2 1.25 1.40 0.048 0.055 C 0.45 0.60 0.017 C2 1.21 1.36 0.047 D 8.95 9.35 0.352 E 10.00 10.28 0.393 G 4.88 5.28 0.192 L 15.00 15.85 0.590 L2 1.27 1.40 0.050 L3 1.40 1.75 0.055 R 0.40 0.016 V2 0 8 0
A E L2 C2
D L L3 A1 B2 B G A2 2mm min. FLAT ZONE R
Max. 0.181 0.106 0.009 0.037 0.024 0.054 0.368 0.405 0.208 0.624 0.055 0.069 8
C
V2
Figure 21: D2PAK Foot Print Dimensions (in millimeters)
16.90
10.30 1.30
5.08
3.70 8.90
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TN12, TS12 and TYNx12 Series
Figure 22: IPAK Package Mechanical Data REF. A A1 A3 B B2 B3 B5 C C2 D E e G H L L1 L2 V1 DIMENSIONS Millimeters Inches Min. Typ. Max. Min. Typ. 2.20 2.40 0.086 0.90 1.10 0.035 0.70 1.30 0.027 0.64 0.90 0.025 5.20 5.40 0.204 0.95 0.30 0.035 0.45 0.60 0.017 0.48 0.60 0.019 6 6.20 0.236 6.40 6.60 0.252 2.28 0.090 4.40 4.60 0.173 16.10 0.634 9 9.40 0.354 0.8 1.20 0.031 0.80 1 0.031 10 10
A E B2 L2 C2
Max. 0.094 0.043 0.051 0.035 0.212 0.037 0.023 0.023 0.244 0.260 0.181 0.370 0.047 0.039
D
H L
L1
B3 B V1 A1
e G
B5
C A3
Figure 23: TO-220AB Package Mechanical Data DIMENSIONS Millimeters Inches Min. Typ. Max. Min. Typ. 15.20 15.90 0.598 3.75 0.147 13.00 14.00 0.511 10.00 10.40 0.393 0.61 0.88 0.024 1.23 1.32 0.048 4.40 4.60 0.173 0.49 0.70 0.019 2.40 2.72 0.094 2.40 2.70 0.094 6.20 6.60 0.244 3.75 3.85 0.147 15.80 16.40 16.80 0.622 0.646 2.65 2.95 0.104 1.14 1.70 0.044 1.14 1.70 0.044 2.60 0.102
REF.
B OI L F A I4 l3 a1 l2 c2 b2 C
a2
M b1 e c1
A a1 a2 B b1 b2 C c1 c2 e F OI I4 L l2 l3 M
Max. 0.625 0.551 0.409 0.034 0.051 0.181 0.027 0.107 0.106 0.259 0.151 0.661 0.116 0.066 0.066
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TN12, TS12 and TYNx12 Series
In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Table 8: Ordering Information Ordering type TN1215-x00B TN1215-x00B-TR TN1215-x00G TN1215-x00G-TR TN1215-x00H TS1220-x00B TS1220-x00B-TR TS1220-x00H TYNx12RG TYNx12TRG
Note: x = voltage
Marking TN1215x00 TN1215x00 TN1215x00G TN1215x00G TN1215x00 TS1220x00 TS1220x00 TS1220x00 TYNx12 TYNx12T
Package DPAK DPAK D2PAK D2PAK IPAK DPAK DPAK IPAK TO-220AB TO-220AB
Weight 0.3 g 0.3 g 1.5 g 1.5 g 0.3 g 0.3 g 0.3 g 0.3 g 2.3 g 2.3 g
Base qty 75 2500 50 1000 75 75 2500 75 50 50
Delivery mode Tube Tape & reel Tube Tape & reel Tube Tube Tape & reel Tube Tube Tube
Table 9: Revision History Date Sep-2000 25-Mar-2005 14-Oct-2005 Revision 3 4 5 Last update. TO-220AB delivery mode changed from bulk to tube. Changed sensitivity values in Table 7 for TYNx12 (30 to 15 mA) and TYNx12T ( 15 to 5 mA). Added ECOPACK statement Description of Changes
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TN12, TS12 and TYNx12 Series
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners (c) 2005 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com
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